4/11/2022
Zsolt Tokei
Zsolt Tokei's 141 research works with 1,429 citations and 11,440 reads, including: Enhancing interface doping in graphene-metal hybrid devices using H2 plasma clean. Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei, and Philippe Vereecken. “Ultra-Low Copper Baths for Sub-35 Nm Copper Interconnects.”.
- Author
- Tanya Atanasova(UGent), Katrien Strubbe(UGent), Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei and Philippe Vereecken
- Organization
- Keywords
- copper plating, filling
Citation
Zsolt Tokei
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-2078506
Atanasova, Tanya, et al. “Ultra-Low Copper Baths for Sub-35 Nm Copper Interconnects.” ECS Meeting Abstracts, vol. 41, ECS, The Electrochemical Society, 2011.
Atanasova, T., Strubbe, K., Carbonell, L., Caluwaerts, R., Tokei, Z., & Vereecken, P. (2011). Ultra-low copper baths for sub-35 nm copper interconnects. In ECS Meeting Abstracts (Vol. 41). Penington, NY, USA: ECS, The Electrochemical Society.
Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei, and Philippe Vereecken. 2011. “Ultra-Low Copper Baths for Sub-35 Nm Copper Interconnects.” In ECS Meeting Abstracts. Vol. 41. Penington, NY, USA: ECS, The Electrochemical Society.
Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei, and Philippe Vereecken. 2011. “Ultra-Low Copper Baths for Sub-35 Nm Copper Interconnects.” In ECS Meeting Abstracts. Vol. 41. Penington, NY, USA: ECS, The Electrochemical Society.
Atanasova T, Strubbe K, Carbonell L, Caluwaerts R, Tokei Z, Vereecken P. Ultra-low copper baths for sub-35 nm copper interconnects. In: ECS Meeting Abstracts. Penington, NY, USA: ECS, The Electrochemical Society; 2011.
Zsolt Tokei Imec
T. Atanasova, K. Strubbe, L. Carbonell, R. Caluwaerts, Z. Tokei, and P. Vereecken, “Ultra-low copper baths for sub-35 nm copper interconnects,” in ECS Meeting Abstracts, Boston, MA, USA, 2011, vol. 41.
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